Customer X is a major packaging manufacturer for SDnand and TF cards. Although they originally used competitive products with low prices, their UPH was small and their stability was poor.

A certain customer Y is a proprietary brand with products such as SSD, eMMC, NAND, etc. During packaging, it is necessary to test the packaging results of the chips. The original testing plan was to use expensive universal testing machines or test boards from the main controller.