Particle Testing of SSD
Industry Pain Points:
① Different wafers and packaging factories may result in uneven quality after packaging - there may be phenomena such as open and short circuits;
② Due to different sources of Die, mixing may occur during the packaging process - it is necessary to use the Read ID method for inspection;
③ Multi die packaging, the quality of each die is difficult to distinguish - it is necessary to select and identify multiple dies;
④ Too many bad blocks in Flash result in insufficient SSD capacity - a capacity scan of Flash is required.
Previous Solutions in the Industry:
Use the finished board from the main controller to perform read ID on the chip.
Disadvantages:
① Not convenient for personalized modification;
② Frequent replacement of multiple main control boards;
③ If there are short circuits or other issues with the packaged chip, it can cause damage to the test board due to short circuits.
YongMing Solution:
Yongming's self-developed test board achieves the following functions:
① OS testing, first screen for open and short circuits;
② Support multi die full capacity scanning;
③ Supports Read IDs for multiple dies.
Unique advantages:
① Compatible with different wiring methods, no need for engineers to configure separately, reducing operational difficulty and workload;
② No master control restrictions, compatible with different types of flash;
③ Can achieve a maximum detection speed of 3s/pcs.
